AndroidUtility.v106.7z
https://mega.nz/file/Mu9zmRBQ#Jg3ESZzEn6T1o7NWT1-xfICBTdUeU0Wwe23aawScVfY Dawnload
Download Android Utility Tool Version 106 New Big update - May 2023
The latest Android Utility V106 update brings several new features and important fixes, enhancing the functionality and performance of supported devices. Released on May 22, 2023, this update introduces support for various Samsung Galaxy and Huawei/Honor models, as well as improvements to extraction and flashing processes.
New Features
Added Samsung Galaxy (A03) [SM-A035M] (all bits) (Latin America variant) one click dead boot repair via USB.
Added Samsung Galaxy (A03 Core) [SM-A032M] (all bits) (Latin America variant) one click dead boot repair via USB.
Added Samsung Galaxy (A03/A03 Core) [SM-A035F/SM-A035G/SM-A032F] (all bits - up to U3) (international) one click dead boot repair via USB (new method, BIT 3 included).
Added Samsung (UniSoC) generic dead boot repair procedure via USB (BETA) for the following models, (need to use (BL) from compatible firmware in order to complete the repair process) :
> Samsung SM-T509 Galaxy Tab A7 10.4
> Samsung SM-X200 Galaxy Tab A8 2021
> Samsung SM-X205 Galaxy Tab A8 2021
> Samsung SM-X205C Galaxy Tab A8 2021
> Samsung SM-X205N Galaxy Tab A8 2021
Some devices won't require eMMC re-partitioning, you can tick (Skip eMMC PMT rebuild) CheckBox to skip IC re-partitioning.
* Added (Huawei/Honor) HiSilicon temp BL unlock (Factory Fastboot) [BETA] for the following SoCs : *
> KIRIN620
> KIRIN650
> KIRIN655
> KIRIN658
> KIRIN659
> KIRIN710
> KIRIN910
> KIRIN920
> KIRIN925
> KIRIN930
> KIRIN935
> KIRIN950
> KIRIN955
> KIRIN960
> KIRIN970
> KIRIN980
The rest of the HiSilicon 5G SoCs such as (810, 985, and 990) will be added to the premium tool later.
eMMC/UFS
Added (eMMC/UFS) dump extractor to raw images, dumps can be extracted with 7zip as well, but UFS ones won’t be extracted (EFI block size is 4096, different from the previously used one in eMMC (512) - not updated to 7zip yet), now you can easily extract (EASY JTAG, UFI) UFS dumps with our software.
to inject some partitions from the dumps example partitions could be useful to extract from dumps [OEMINFO, oppo_cusrom, nvram, nvdata] for any purposes.
Huawei/Honor
Fixed (Huawei/Honor) Qualcomm UFS firmware extractor (UPDATE.APP) to (rawprogram[x].xml), previously the software creates an XML containing the (APPs) partitions only and skips some partitions which couldn't be found inside the factory package, such as (bootfail_info, persist, oeminfo, modem NV partitions), this might cause (device verification failed issue), now the procedure is revised, and the software extracts all partitions and creates a semi-factory XML according to GPT partitions from APP file).
(Huawei/Honor) board firmware flashing was revised and fixed.
* Now the software can extract (UPDATE.APP) to (XML files for QUALCOMM CPU and scatter for MTK CPU).
Samsung
Fixed Samsung flashing issues (Download mode).
Bug Fixes
Fixed a bug that come to the software to crash when extracting firmware for some devices.
Fixed a bug that caused the software to incorrectly extract the (BL) partition.
Fixed a bug that caused the software to incorrectly extract the (modem) partition.
Fixed many other minor bugs.
Features:
MediaTek [BootROM]:-
> Dump Preloader
> Crash Preloader To Brom
> Reboot AT Mode
> Reboot Factory Mode
> Reboot Fastboot Mode
> Read Device Info [BootROM]
> (eMMC/UFS) Health Check [BootROM]
> Read (eMMC/UFS)[USER_SECTION] Dump (USB) [16MB]
> Write (eMMC/UFS)[USER_SECTION] Dump (USB)
> Read (eMMC/UFS) BOOT_SECTION (LUNO/BOOT1)
> Write (eMMC/UFS) BOOT_SECTION (LUNO/BOOT1)
> Redmi 6A (cactus) Unlock Bootloader
> Xiaomi 11T (agate) Unlock Bootloader
> Xiaomi 111 (agate) Re-Lock Bootloader
> Redmi Note 11 Pro+ 5G (pissarro) Unlock Bootloader
> Redmi Note 11 Pro+ 5G (pissarro) Re-Lock Bootloader
> LGE New SEC Force BRom (FM)
> VIVO New SEC Readinfo (FM)
> VIVO (MT6771/MT6765) Force BRom
> VIVO (MT6771/MT6765) Exit BRom
> VIVO (MT6771/MT6765) Remove Demo
MediaTek [Meta Mode]:-
File Password > mfdl
Dawnload file


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